Can anyone help me with a problem I am encountering on specifying the surface finish on a new BGA System in Package module. So far I have been advised to look at a palladium / nickel / gold solution but does that have any advantages over nickel / gold process. It seems more costly.
Thanks
Luca
3/2/2017 10:01:41 AM
Bravo! Hope you can write soon.
Adair
3/2/2017 10:01:41 AM
I certainly enjoyed reading your post.
Mikael
3/2/2017 10:01:41 AM
Very valuable!
chrisjmears
3/2/2017 10:01:41 AM
Many thanks. Your idea is very valuable. Will certainly share this post with my pals.